High Frequency Microsystems

Institution

School of Advanced Professional Studies Ulm University

Target Audience

The module “High Frequency Microsystems” is aimed at bachelor, diploma or state examination graduates with solid basic knowledge in an engineering subject, technical computer science or physics, who would like to deal intensively with issues relating to sensor technology and systems engineering.

Prerequisites

Prerequisite is a first university degree e.g. bachelor, diploma, state examination etc. in a technical subject. Students should have knowledge of the fundamentals of electrical engineering, calculations of complex alternating currents, and fundamentals in analog electronics.

Content

• High Frequency Microsystems: Overview
• Ambient Intelligence as a High Frequency Microsystem Use Scenario
• Wireless Sensor Networks Scenario
• Trends in the Semiconductor Industry
• Semiconductor technologies for micro- and millimeter-wave ICs (MMICs)
• MMIC design methodologies
• Packaging Technologies for High Frequency Microsystems
• Packaging and Interconnect Parasitics
• Technology of Micro-Electro-Mechanical Structures for Radio Frequency Applications (RFMEMS)
• RFMEMS Components
• RFMEMS/BiCMOS Integration
• Final Case Study: 30 GHz Active Antenna System
• Virtual Design Practice

Programme Details

The online study takes place in self-study and in the form of group work. For self-study, video lectures are available, which clearly present the module content, and a detailed script. The reader-friendly script is prepared according to the didactic concept of the University of Ulm for part-time participants. It contains, for example, learning stops, multiple and single choice questions, quizzes, exercises, etc.

Your mentor will offer you online consultation sessions in the form of seminars at regular intervals to help you work through the exercise sheets and thus support you in working through the learning material.

An online forum for exchange with the other participants will also be available.

The knowledge acquired in the online study is deepened on attendance days.

Learning Objectives

• Participants will be able to identify various areas of application for compact high-frequency and microwave systems in telecommunications and sensor technology
• They are able to analyze the application and determine requirements for the housing and connection technology under special requirements of high operating frequencies
• Using simple case studies, participants will be able to determine advantages and disadvantages of“system-on-chip” as well as a “system-in-package” approach and identify possible applications for microelectromechanical components in high-frequency microsystems
• Finally, participants will be able to evaluate a complex case study that considers circuit technology, packaging technology and micromechanical components in their interaction in microsystems

Course Format

Blended-Learning

Certification

Upon successful completion of the module, you will receive a certificate as well as a supplement that lists the contents of the module as an overview.

Workload

The module requires a total of 180 hours of workload.

Language

Deutsch / English

This course has already started. When new courses become available they will be added.

• Prof. Dr.-Ing. Hermann Schumacher, Institute of Electron Devices and Circuits, University of Ulm
• Steven El-Bittar, Institute of Electron Devices and Circuits, University of Ulm